The Union Cabinet, on Wednesday approved the setting up of a new semiconductor manufacturing unit in Uttar Pradesh. This will be the sixth facility under the India Semiconductor Mission, underscoring the nation’s drive towards self-reliance in this critical technology sector.
The approved unit is a joint venture between HCL, a pioneer in hardware manufacturing, and global electronics giant Foxconn. The new plant will be located near Jewar Airport in the Yamuna Expressway Industrial Development Authority (YEIDA) region. Designed to manufacture display driver chips, the facility will cater to a wide range of devices including mobile phones, laptops, automobiles, PCs, and other electronics.
With a production capacity of 20,000 wafers per month and an output target of chips 36 million (3.6 crore) monthly, the plant is expected to significantly enhance India’s semiconductor manufacturing capabilities. The project will attract an investment of ₹3,700 crore.
The announcement comes as India’s semiconductor landscape continues to evolve rapidly. Five semiconductor units are already in advanced stages of construction, and world-class design facilities have emerged across multiple states. Currently, 270 academic institutions and 70 startups are actively engaged in semiconductor design innovation, with 20 student-developed products having been taped out by the Semiconductor Laboratory (SCL) in Mohali.
